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	1.	Wire bonding in microelectronics [Book] : materials, processes, reliability, and yield / George G. Harmon. by Harman, George G Harman, George G. Reliability and yield problems of wire bonding in microelectronics Series: Electronic packaging and interconnection series Edition: 2nd ed. Material type: Text; Format: print ; Literary form: Not fiction Publication details: New York : McGraw-Hill, c1997 Availability: Items available for loan: Junaid Zaidi Library, COMSATS University Islamabad (1)Call number: 621.3815 HAR-W. Place hold Add to cart (remove)
	2.	WAP the net [Book] : an introduction to wireless application protocol / Kamlesh N. Agarwala, Prateek Amar Agarwala. by Agarwala, Kamlesh N Agarwala, Prateek Amar Material type: Text; Literary form: Not fiction Publication details: New Delhi : Macmillan India Limited, c2001 Availability: Items available for loan: Junaid Zaidi Library, COMSATS University Islamabad (1)Call number: 004.62 AGA-W. Place hold Add to cart (remove)
	3.	Thermo-mechanical simulation and processing of steels [Book] / Edited by Sudhaker Jha---[et al]. Material type: Text; Literary form: Not fiction Publication details: New Delhi : Viva Books Private limited, 2004 Availability: Items available for loan: Junaid Zaidi Library, COMSATS University Islamabad (1)Call number: 621.381046 THE. Place hold Add to cart (remove)
	4.	Practical guide to the packaging of electronics [Book] : thermal and mechanical design and analysis / Ali Jamnia. by Jamnia, Ali, 1961- Series: Material type: Text; Format: print ; Literary form: Not fiction Publication details: New York : Marcel Dekker, c2003 Availability: Items available for loan: Junaid Zaidi Library, COMSATS University Islamabad (1)Call number: 621.381046 JAM-P. Place hold Add to cart (remove)
	5.	Physical architecture of VLSI systems [Book] / edited by Robert J. Hannemann, Allan D. Kraus, Michael Pecht. by Hannemann, Rob, 1925- Kraus, Allan D Pecht, Michael Material type: Text; Format: print ; Literary form: Not fiction Publication details: New York : John Wiley & Sons, Inc., c1994 Availability: Items available for loan: Junaid Zaidi Library, COMSATS University Islamabad (1)Call number: 621.381046 PHY. Place hold Add to cart (remove)
	6.	Multichip module design, fabrication, and testing [Book] / James J. Licari. by Licari, James J, 1930- Series: Electronic packaging and interconnection series Material type: Text; Format: print ; Literary form: Not fiction Publication details: New York : McGraw-Hill, c1995 Availability: Items available for loan: Junaid Zaidi Library, COMSATS University Islamabad (1)Call number: 621.381046 LIC-M. Place hold Add to cart (remove)
	7.	Lead-free soldering in electronics [Book] : science, technology and environmental impact / edited by Katsuaki Suganuma. by Suganuma, Katsuaki Material type: Text; Format: print ; Literary form: Not fiction Publication details: New York : London : Marcel Dekker ; Momenta, c2004 Availability: Items available for loan: Junaid Zaidi Library, COMSATS University Islamabad (2)Call number: 621.381046 LEA, ... Place hold Add to cart (remove)
	8.	Influence of temperature on microelectronics and system reliability [Book] / Pradeep Lall, Michael G. Pecht, Edward B. Hakim. by Lall, Pradeep Pecht, Michael Hakim, Edward B Series: Material type: Text; Format: print ; Literary form: Not fiction Publication details: Boca Raton : CRC Press, c1997 Availability: Items available for loan: Junaid Zaidi Library, COMSATS University Islamabad (1)Call number: 621.381046 LAL-I. Place hold Add to cart (remove)
	9.	Guidebook for managing silicon chip reliability [Book] / Michael G. Pecht, Riko Radojcic, Gopal Rao. by Pecht, Michael Radojcic, Riko Rao, Gopal K Series: Electronic packaging series Material type: Text; Format: print ; Literary form: Not fiction Publication details: Boca Raton, Fla. : CRC Press, c1999 Availability: Items available for loan: Junaid Zaidi Library, COMSATS University Islamabad (1)Call number: 621.3815 PEC-G. Place hold Add to cart (remove)
	10.	Electronics manufacturing [Book] / with lead-free, halogen-free, and conductive-adhesive materials John H. Lau ... [et al.]. by Lau, John H Series: McGraw-Hill handbooks Material type: Text; Format: electronic ; Literary form: Not fiction ; Audience: Specialized; Publication details: New York : McGraw-Hill. Availability: Items available for loan: Junaid Zaidi Library, COMSATS University Islamabad (1)Call number: 621.381 ELE. Place hold Add to cart (remove)
	11.	Electronic techniques [Book] : shop practices and construction / Robert S. Villanucci, Alexander W. Avtgis, William F. Megow. by Villanucci, Robert S, 1944- Avtgis, Alexander W, 1931- Megow, William F, 1936- Edition: 5th ed. Material type: Text; Format: print ; Literary form: Not fiction Publication details: Englewood Cliffs, N.J. : Prentice Hall, c1996 Availability: Items available for loan: Junaid Zaidi Library, COMSATS University Islamabad (2)Call number: 621.381 VIL-E, ... Place hold Add to cart (remove)
	12.	Electronic packaging materials and their properties [Book] / Michael G. Pecht ... [et al.]. by Pecht, Michael G Agarwal, Rakesh McCluskey,Patrick Dishongh, Terrance Javadpour, Sirus Mahajan, Rahul Series: The electronic packaging series Material type: Text; Format: print ; Literary form: Not fiction Publication details: Boca Raton : CRC Press, c1999 Availability: Items available for loan: Junaid Zaidi Library, COMSATS University Islamabad (1)Call number: 621.381046 ELE. Place hold Add to cart (remove)
	13.	Contamination of electronic assemblies [Book] / Michael Pecht ... [et al.]. by Pecht, Michael Bumiller, Elissa Douthit, David A Pecht, Joan Series: The electronic packaging series Material type: Text; Format: print ; Literary form: Not fiction Publication details: Boca Raton, Fla. : CRC Press, c2003 Availability: Items available for loan: Junaid Zaidi Library, COMSATS University Islamabad (1)Call number: 621.381046 CON. Place hold Add to cart (remove)