Wire bonding in microelectronics [Book] : materials, processes, reliability, and yield / George G. Harmon.
Material type: TextSeries: Electronic packaging and interconnection seriesPublication details: New York : McGraw-Hill, c1997.Edition: 2nd edDescription: xiv, 290 p. : ill. ; 24 cmISBN:- 0070326193 (hbk)
- 621.3815 21
- 621.3815
Item type | Current library | Call number | Status | Date due | Barcode | Item holds |
---|---|---|---|---|---|---|
Books | Junaid Zaidi Library, COMSATS University Islamabad Ground Floor | 621.3815 HAR-W (Browse shelf(Opens below)) | Available | 24919 |
Total holds: 0
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