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Wire bonding in microelectronics [Book] : materials, processes, reliability, and yield / George G. Harmon.

By: Contributor(s): Material type: TextTextSeries: Electronic packaging and interconnection seriesPublication details: New York : McGraw-Hill, c1997.Edition: 2nd edDescription: xiv, 290 p. : ill. ; 24 cmISBN:
  • 0070326193 (hbk)
Subject(s): DDC classification:
  • 621.3815 21
Other classification:
  • 621.3815
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Holdings
Item type Current library Call number Status Date due Barcode Item holds
Books Books Junaid Zaidi Library, COMSATS University Islamabad Ground Floor 621.3815 HAR-W (Browse shelf(Opens below)) Available 24919
Total holds: 0

Includes index

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