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	1.	Wire bonding in microelectronics [Book] : materials, processes, reliability, and yield / George G. Harmon. by Harman, George G Harman, George G. Reliability and yield problems of wire bonding in microelectronics Series: Electronic packaging and interconnection series Edition: 2nd ed. Material type: Text; Format: print ; Literary form: Not fiction Publication details: New York : McGraw-Hill, c1997 Availability: Items available for loan: Junaid Zaidi Library, COMSATS University Islamabad (1)Call number: 621.3815 HAR-W. Place hold Add to cart (remove)
	2.	Multichip module design, fabrication, and testing [Book] / James J. Licari. by Licari, James J, 1930- Series: Electronic packaging and interconnection series Material type: Text; Format: print ; Literary form: Not fiction Publication details: New York : McGraw-Hill, c1995 Availability: Items available for loan: Junaid Zaidi Library, COMSATS University Islamabad (1)Call number: 621.381046 LIC-M. Place hold Add to cart (remove)
	3.	Electronic systems quality management handbook [Book] / Marsha Ludwig-Becker, editor. by Ludwig-Becker, Marsha Series: Electronic packaging and interconnection series Material type: Text; Format: print ; Literary form: Not fiction Publication details: New York : McGraw-Hill, c1998 Availability: Items available for loan: Junaid Zaidi Library, COMSATS University Islamabad (2)Call number: 621.3810685 ELE, ... Place hold Add to cart (remove)
	4.	Electronic assembly fabrication [Book] : chips, circuit boards, packages, and components / Charles A. Harper, editor-in-chief. by Harper, Charles A Series: McGraw-Hill professional engineering \| Electronic packaging and interconnection series Material type: Text; Format: print ; Literary form: Not fiction Publication details: New York : McGraw-Hill, c2002 Availability: Items available for loan: Junaid Zaidi Library, COMSATS University Islamabad (1)Call number: 621.381 ELE. Place hold Add to cart (remove)