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Silicon wafer bonding technology [Book] : for VLSI and MEMS applications / edited by Subramanian S. Iyer and Andre J. Auberton-Herv.̌

Contributor(s): Material type: TextTextSeries: EMIS processing series ; no. 1Publication details: London : Institution of Electrical Engineers, c2002.Description: xxv, 149 p. : ill. ; 26 cmISBN:
  • 0852960395
Subject(s): DDC classification:
  • 621.38152 21
Other classification:
  • 621.38152
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