| 000 | 00618nam a2200217Ia 4500 | ||
|---|---|---|---|
| 005 | 20231121100026.0 | ||
| 008 | 231120s9999 xx 000 0 und d | ||
| 020 | _a0-07-136327-0 | ||
| 040 |
_aLIS CUI Lahore _cAACR-II/RDA |
||
| 082 | _a621.38104 LAU-M | ||
| 100 | _aLau, John H. | ||
| 245 | 0 | _aMicrovias for Low Cost, High Density Interconnects | |
| 260 |
_aNew York _bMcGraw Hill |
||
| 264 | _c0 | ||
| 300 |
_aHard Binding _b 565 |
||
| 365 |
_b2762 _cRs. |
||
| 546 | _aEnglish | ||
| 650 | _xMicrovias, Low Cost, High Density | ||
| 852 | _pLHR 9170 | ||
| 942 |
_2lhr _cLHR 9170 _h1 |
||
| 999 |
_c467388 _d467388 |
||