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1.
Wire bonding in microelectronics [Book] : materials, processes, reliability, and yield / George G. Harmon. by Series: Electronic packaging and interconnection series
Edition: 2nd ed.
Material type: Text Text; Format: print ; Literary form: Not fiction
Publication details: New York : McGraw-Hill, c1997
Availability: Items available for loan: Junaid Zaidi Library, COMSATS University Islamabad (1)Call number: 621.3815 HAR-W.

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2.
WAP the net [Book] : an introduction to wireless application protocol / Kamlesh N. Agarwala, Prateek Amar Agarwala. by
Material type: Text Text; Literary form: Not fiction
Publication details: New Delhi : Macmillan India Limited, c2001
Availability: Items available for loan: Junaid Zaidi Library, COMSATS University Islamabad (1)Call number: 004.62 AGA-W.

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