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1.
Silicon wafer bonding technology [Book] : for VLSI and MEMS applications / edited by Subramanian S. Iyer and Andre J. Auberton-Herv.̌ by Series: EMIS processing series ; no. 1
Material type: Text Text; Format: print ; Literary form: Not fiction
Publication details: London : Institution of Electrical Engineers, c2002
Availability: Items available for loan: Junaid Zaidi Library, COMSATS University Islamabad (2)Call number: 621.38152 SIL, ...

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2.
Process technology for silicon carbide devices [Book] / edited by Carl-Mikael Zatterling. by Series: EMIS processing series ; no. 2.
Material type: Text Text; Format: print ; Literary form: Not fiction
Publication details: London : Institution of Electrical Engineers, c2002
Availability: Items available for loan: Junaid Zaidi Library, COMSATS University Islamabad (4)Call number: 621.38152 PRO, ...

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