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	1.	Microvias for Low Cost, High Density Interconnects by Lau, John H Material type: Text; Format: print ; Literary form: Not fiction 0 Availability: Items available for loan: COMSATS University Lahore Campus (1)Call number: 621.38104 LAU-M. Place hold Add to cart (remove)
	2.	Microvias [Book] : for low cost, high density interconnects / John H. Lau, S.W. Ricky Lee. by Lau, John H Lee, S. W. Ricky Series: McGraw-Hill professional engineering Material type: Text; Format: print ; Literary form: Not fiction Publication details: New York : McGraw-Hill, c2001 Availability: Items available for loan: Junaid Zaidi Library, COMSATS University Islamabad (1)Call number: 621.381046 LAU-M. Place hold Add to cart (remove)
	3.	Microvias by Lau, John h Material type: Text; Format: print ; Literary form: Not fiction 0 Availability: Items available for loan: COMSATS University Lahore Campus (1)Call number: 621.38104 LAU-M. Place hold Add to cart (remove)
	4.	Flip chip technologies [Book] / John H. Lau, editor. by Lau, John H Series: Material type: Text; Format: print ; Literary form: Not fiction Publication details: New York : McGraw-Hill, c1996 Availability: Items available for loan: Junaid Zaidi Library, COMSATS University Islamabad (1)Call number: 621.381046 FLI. Place hold Add to cart (remove)
	5.	Electronics manufacturing [Book] / with lead-free, halogen-free, and conductive-adhesive materials John H. Lau ... [et al.]. by Lau, John H Series: McGraw-Hill handbooks Material type: Text; Format: electronic ; Literary form: Not fiction ; Audience: Specialized; Publication details: New York : McGraw-Hill. Availability: Items available for loan: Junaid Zaidi Library, COMSATS University Islamabad (1)Call number: 621.381 ELE. Place hold Add to cart (remove)