Harman, George G. Wire bonding in microelectronics materials, processes, reliability, and yield / [Book] : George G. Harmon. - 2nd ed. - New York : McGraw-Hill, c1997. - xiv, 290 p. : ill. ; 24 cm. - Electronic packaging and interconnection series . Includes index All. ISBN: 0070326193 (hbk) Subjects--Topical Terms: Wire bonding (Electronic packaging)--Production control.Electronic packaging--Reliability.Electronic packaging--Defects.Semiconductors--Failures. Dewey Class. No.: 621.3815