Lau, John H. <br/><br/>
Microvias for Low Cost, High Density Interconnects 

 - New York  McGraw Hill 
 - Hard Binding            565 
<br/><br/><br/>English 
<br/><br/><label>ISBN: </label>0-07-136327-0 
<br/><br/><label>Subjects--Topical Terms: </label>--Microvias, Low Cost, High Density
<br/><br/><label>Dewey Class. No.: </label>621.38104 LAU-M