Silicon wafer bonding technology  for VLSI and MEMS applications /  [Book] : 
edited by Subramanian S. Iyer and Andre J. Auberton-Herv.̌ 
 - London :  Institution of Electrical Engineers,  c2002. 
 - xxv, 149 p. :  ill. ;  26 cm. 
 - EMIS processing series  ;  no. 1 .
<br/><br/> All. 
<br/><br/><label>ISBN: </label>0852960395 
<br/><br/><label>Nat. Bib. No.: </label>GBA1-V4185 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Silicon-on-insulator technology.<br/>Integrated circuits--Very large scale integration.<br/>Microelectromechanical systems.
<br/><br/><label>Dewey Class. No.: </label>621.38152