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Microvias for Low Cost, High Density Interconnects
Material type:
Text 0Description: Hard Binding 565ISBN: - 0-07-136327-0
- 621.38104 LAU-M
| Item type | Current library | Call number | Copy number | Status | Date due | Barcode | Item holds |
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COMSATS University Lahore Campus | 621.38104 LAU-M (Browse shelf(Opens below)) | 1 | Available | LHR 9170 |
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| 621.38103 YOU-T The Penguin dictionary of electronics | 621.3810321 BHA-D Dictionary of electronics | 621.38104 LAU-M Microvias | 621.38104 LAU-M Microvias for Low Cost, High Density Interconnects | 621.381043 BAK-M Measurements and instrumentation | 621.381044 AGR-P Pneumatic Systems Principles and Maintenance | 621.381044 AHM-P Power Electonics for Technology |
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