Wire bonding in microelectronics [Book] : materials, processes, reliability, and yield / George G. Harmon.

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TextSeries: Electronic packaging and interconnection seriesPublication details: New York : McGraw-Hill, c1997.Edition: 2nd edDescription: xiv, 290 p. : ill. ; 24 cmISBN:

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Holdings
Item type	Current library	Call number	Status	Date due	Barcode	Item holds
Books	Junaid Zaidi Library, COMSATS University Islamabad	621.3815 HAR-W (Browse shelf(Opens below))	Available		24919

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Previous	621.3815 GUP-E Electronic devices and circuits	621.3815 GUP-F Fundamenatals of electronic devices	621.3815 HAR-T Three-dimensional integrated circuit layout	621.3815 HAR-W Wire bonding in microelectronics materials, processes, reliability, and yield /	621.3815 HAY-E Electronic circuit analysis and design	621.3815 HAY-E Electronic circuit analysis and design	621.3815 HEA-I Introductory digital electronics from truth tables to microprocessors /	Next

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