Wire bonding in microelectronics (Record no. 168012)

MARC details
000 -LEADER
fixed length control field 01118pam a2200301 a 4500
001 - CONTROL NUMBER
control field 0000036414
003 - CONTROL NUMBER IDENTIFIER
control field 0001
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 970508s1997 nyua b 001 0 eng
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
International Standard Book Number 0070326193 (hbk)
035 ## - SYSTEM CONTROL NUMBER
-- (DLC) 97019652
040 ## - CATALOGING SOURCE
Original cataloging agency DLC
Transcribing agency DLC
Modifying agency DLC
082 00 - DEWEY DECIMAL CLASSIFICATION NUMBER
Classification number 621.3815
Edition number 21
084 ## - OTHER CLASSIFICATION NUMBER
Classification number 621.3815
Item number HAR-W
100 1# - MAIN ENTRY--PERSONAL NAME
Personal name Harman, George G.
245 10 - TITLE STATEMENT
Title Wire bonding in microelectronics
Medium [Book] :
Remainder of title materials, processes, reliability, and yield /
Statement of responsibility, etc. George G. Harmon.
250 ## - EDITION STATEMENT
Edition statement 2nd ed.
260 ## - PUBLICATION, DISTRIBUTION, ETC.
Place of publication, distribution, etc. New York :
Name of publisher, distributor, etc. McGraw-Hill,
Date of publication, distribution, etc. c1997.
300 ## - PHYSICAL DESCRIPTION
Extent xiv, 290 p. :
Other physical details ill. ;
Dimensions 24 cm.
440 #0 - SERIES STATEMENT/ADDED ENTRY--TITLE
Title Electronic packaging and interconnection series
500 ## - GENERAL NOTE
General note Includes index
521 ## - TARGET AUDIENCE NOTE
Target audience note All.
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Wire bonding (Electronic packaging)
General subdivision Production control.
Topical term or geographic name entry element Electronic packaging
General subdivision Reliability.
Topical term or geographic name entry element Electronic packaging
General subdivision Defects.
Topical term or geographic name entry element Semiconductors
General subdivision Failures.
700 1# - ADDED ENTRY--PERSONAL NAME
Personal name Harman, George G.
Title of a work Reliability and yield problems of wire bonding in microelectronics.
852 ## - LOCATION
Accession No. 24919
-- 0.00
Former shelving location Books
Holdings
Withdrawn status Lost status Damaged status Not for loan Home library Current library Shelving location Date acquired Total checkouts Full call number Barcode Date last seen Price effective from Koha item type
        Junaid Zaidi Library, COMSATS University Islamabad Junaid Zaidi Library, COMSATS University Islamabad   18/09/2023   621.3815 HAR-W 24919 18/09/2023 18/09/2023 Books