Wire bonding in microelectronics materials, processes, reliability, and yield /
Harman, George G.
Wire bonding in microelectronics materials, processes, reliability, and yield / [Book] : George G. Harmon. - 2nd ed. - New York : McGraw-Hill, c1997. - xiv, 290 p. : ill. ; 24 cm. - Electronic packaging and interconnection series .
Includes index
All.
0070326193 (hbk)
Wire bonding (Electronic packaging)--Production control.
Electronic packaging--Reliability.
Electronic packaging--Defects.
Semiconductors--Failures.
621.3815
Wire bonding in microelectronics materials, processes, reliability, and yield / [Book] : George G. Harmon. - 2nd ed. - New York : McGraw-Hill, c1997. - xiv, 290 p. : ill. ; 24 cm. - Electronic packaging and interconnection series .
Includes index
All.
0070326193 (hbk)
Wire bonding (Electronic packaging)--Production control.
Electronic packaging--Reliability.
Electronic packaging--Defects.
Semiconductors--Failures.
621.3815