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MEMS packaging

MEMS packaging [Book] / edited by Tai-Ran Hsu. - London : Institution of Electrical Engineers, 2004. - xxix, 275 p. : ill.

All.

ISBN: 0863413358

Subjects--Topical Terms:
Microelectromechanical systems.
Microelectronic packaging.

Dewey Class. No.: 621.381

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